Optical member, display device having the same and method of fabricating the same

ABSTRACT

Disclosed are an optical member, a display device including the optical member and a method of fabricating the optical member. The display device includes a light source; a wavelength conversion member into which light generated from the light source is incident; and a display panel into which light is incident from the wavelength conversion member. The wavelength conversion member includes a receiving part having a pipe shape; a matrix in the receiving part; and a plurality of wavelength conversion particles disposed in the matrix to convert a wavelength of the light generated from the light source.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 13/354,468,filed Jan. 20, 2012, which claims the benefit under 35 U.S.C. §119 ofKorean Patent Application No. 10-2011-0006524, filed Jan. 21, 2011,which is hereby incorporated by reference in its entirety.

BACKGROUND

The disclosure relates to an optical member and a display device.

A light emitting diode (LED) is a semiconductor device that convertselectricity into ultraviolet ray, visible ray or infrared ray by usingcharacteristics of compound semiconductors. The LED is mainly used forhome appliances, remote controllers and large-size electric signboards.

A high-brightness LED is used as a light source for a lighting device.Since the LED represents the superior energy efficiency and long lifespan, the replacement cost may be reduced. In addition, the LED isstrong against vibration and impact and it is not necessary to use toxicsubstances, such as Hg, so the LED substitutes for a glow lamp and afluorescent lamp in terms of energy saving, environmental protection andcost reduction.

In addition, the LED may be advantageously used as a light source for amiddle-size or large-size LCD TV and a monitor. When comparing with acold cathode fluorescent lamp (CCFL) mainly used in a liquid crystaldisplay (LCD), the LED represents superior color purity and low powerconsumption and can be fabricated in a small size, so various productsequipped with the LED have been produced and studies for the LED havebeen actively performed.

Recently, various technologies have been suggested to generate whitelight by using a blue LED and a quantum dot (QD) serving as a phosphorto emit red light and green light. This is because the white lightgenerated by using the quantum dot may have the high brightness andsuperior color reproduction property.

Nevertheless, studies and research are still necessary to reduce thelight loss and to improve the color uniformity when the quantum dot isemployed in an LED backlight unit.

BRIEF SUMMARY

The embodiment provides an optical member having superior reliabilityand chemical resistance, a display device having the optical member anda method of fabricating the optical member.

A wavelength conversion member according to the embodiment is placed ina matrix having a superior sealing function. In particular, the matrixmay include epoxy resin, acryl resin, polyimide, silicon resin orpolycarbonate to reduce penetration of oxygen and moisture from theoutside.

Therefore, the matrix can effectively protect wavelength conversionparticles from the external chemical impact.

Especially, when the matrix is disposed in a tube, since the matrix hasthe superior sealing function, it is not necessary to use additionalsealing parts to seal both ends of the tube.

Thus, the wavelength conversion member according to the embodiment canbe readily fabricated.

In addition, the display device according to the embodiment may have thesuperior reliability and improved image quality.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of a liquid crystal displaydevice according to the embodiment;

FIG. 2 is a sectional view taken along line A-A′ of FIG. 1;

FIG. 3 is a perspective view of a wavelength conversion member accordingto the embodiment;

FIG. 4 is a sectional view taken along line B-B′ of FIG. 3;

FIG. 5 is a sectional view of a wavelength conversion member accordingto another embodiment;

FIGS. 6 to 8 are views showing the procedure for fabricating awavelength conversion member according to the embodiment; and

FIG. 9 is a view showing the procedure for fabricating a wavelengthconversion member according to another embodiment.

DETAILED DESCRIPTION

Hereinafter, a liquid crystal display device according to theembodiments will be described in detail with reference to accompanyingdrawings. In the description of the embodiments, it will be understoodthat, when a substrate, a frame, a sheet, a layer or a pattern isreferred to as being “on” or “under” another substrate, another frame,another sheet, another layer, or another pattern, it can be “directly”or “indirectly” on the other substrate, frame, sheet, layer, or pattern,or one or more intervening layers may also be present. Such a positionof the layer has been described with reference to the drawings. The sizeof elements shown in the drawings may be exaggerated for the purpose ofconvenience or clarity. In addition, the size of elements does notutterly reflect an actual size.

FIG. 1 is an exploded perspective view of a liquid crystal displaydevice according to the first embodiment. FIG. 2 is a sectional viewtaken along line A-A′ of FIG. 1. FIG. 3 is a perspective view of awavelength conversion member according to the first embodiment. FIG. 4is a sectional view taken along line B-B′ of FIG. 3. FIG. 5 is asectional view of a wavelength conversion member according to anotherembodiment. FIGS. 6 to 8 are views showing the procedure for fabricatinga wavelength conversion member according to the embodiment. FIG. 9 is aview showing the procedure for fabricating a wavelength conversionmember according to another embodiment.

Referring to FIGS. 1 to 4, the liquid crystal display device accordingto the embodiment includes a mold frame 10, a backlight assembly 20 anda liquid crystal panel 30.

The mold frame 10 receives the backlight assembly 20 and the liquidcrystal panel 30. The mold frame 10 has a rectangular frame shape. Forinstance, the mold frame 10 may include plastic or reinforced plastic.

A chassis, which surrounds the mold frame 10 and supports the backlightassembly 20, may be disposed below the mold frame 10. The chassis mayalso be disposed at the lateral side of the mold frame 10.

The backlight assembly 20 is disposed inside the mold frame 10. Thebacklight assembly generates light and emits the light toward the liquidcrystal panel 30. The backlight assembly 20 includes a reflective sheet100, a light guide plate 200, light emitting diodes 300, a wavelengthconversion member 400, a plurality of optical sheets 500, and a flexibleprinted circuit board (FPCB) 600.

The reflective sheet 100 reflects the light, which is generated from thelight emitting diodes 300, in the upward direction.

The light guide plate 200 is disposed on the reflective sheet 100. Thelight guide plate 200 receives the light generated from the lightemitting diodes 300 and reflects the light in the upward directionthrough the reflection, refraction, and scattering.

The light guide plate 200 includes an incident surface facing the lightemitting diodes 300. Among the lateral sides of the light guide plate200, a lateral side facing the light emitting diodes 300 may serve asthe incident surface.

The light emitting diodes 300 are disposed at the lateral side of thelight guide plate 200. In detail, the light emitting diodes 300 aredisposed at the incident surface of the light guide plate 200.

The light emitting diodes 300 may serve as light sources for generatingthe light. In detail, the light emitting diodes 300 may emit the lighttoward the wavelength conversion member 400.

The light emitting diodes 300 may be blue light emitting diodes thatgenerates blue light or UV light emitting diodes that emits UV light.That is, the light emitting diodes 300 may generate the blue lighthaving the wavelength band in the range of about 430 nm to about 460 nm,or the UV light having the wavelength band in the range of about 300 nmto about 400 nm.

The light emitting diodes 300 may be mounted on the FPCB 600. The lightemitting diodes 300 may be disposed under the FPCB 600. The lightemitting diodes 300 may be driven by receiving the driving signalthrough the FPCB 600.

The wavelength conversion member 400 is disposed between the lightemitting diodes 300 and the light guide plate 200. The wavelengthconversion member 400 is bonded to the lateral side of the light guideplate 200. In detail, the wavelength conversion member 400 is bonded tothe incident surface of the light guide plate 200. In addition, thewavelength conversion member 400 can be bonded to the light emittingdiodes 300.

The wavelength conversion member 400 receives the light emitted from thelight emitting diodes 300 in order to convert the wavelength of thelight. In detail, the wavelength conversion member 400 may convert theblue light emitted from the light emitting diodes 300 into the greenlight and the red light. That is, the wavelength conversion member 400may convert a part of the blue light into the green light having thewavelength in the range of about 520 nm to about 560 nm and a part ofthe blue light into the red light having the wavelength in the range ofabout 630 nm to about 660 nm.

In addition, the wavelength conversion member 400 may convert the UVlight emitted from the light emitting diodes 300 into the blue light,the green light and the red light. That is, the wavelength conversionmember 400 may convert a part of the UV light into the blue light havingthe wavelength in the range of about 430 nm to about 470 nm, a part ofthe UV light into the green light having the wavelength in the range ofabout 520 nm to about 560 nm and a part of the UV light into the redlight having the wavelength in the range of about 630 nm to about 660nm.

Therefore, the white light may be generated by the light passing throughthe wavelength conversion member 400 and the lights converted by thewavelength conversion member 400. In detail, the white light can beincident into the light guide plate 200 through the combination of theblue light, the green light and the red right.

As shown in FIGS. 3 and 4, the wavelength conversion member 400 includesa tube 410, a plurality of wavelength conversion particles 420, and amatrix 430.

The tube 410 receives the wavelength conversion particles 420 and thematrix 430 therein. That is, the tube 410 may serve as a receptacle toreceive the wavelength conversion particles 420 and the matrix 430. Inaddition, the tube 410 extends in one direction.

The tube 410 may have a rectangular shape. In detail, a section of thetube 410, which is vertical to the length direction of the tube 410, mayhave the rectangular shape. In addition, the tube 410 may have a widthof about 0.6 mm and a height of about 0.2 mm. The tube 410 may include acapillary tube.

The wavelength conversion particles 420 are provided in the tube 410. Indetail, the wavelength conversion particles 420 are uniformlydistributed in the matrix 430 installed in the tube 410. That is, thewavelength conversion particles 420 are inserted into the matrix 430.

The wavelength conversion particles 420 convert the wavelength of thelight emitted from the light emitting diodes 300. In detail, thewavelength conversion particles 420 receive the light emitted from thelight emitting diodes 300 in order to convert the wavelength of thelight. For instance, the wavelength conversion particles 420 can convertthe blue light emitted from the light emitting diodes 300 into the greenlight and the red light. That is, a part of the wavelength conversionparticles 420 converts the blue light into the green light having thewavelength in the range of about 520 nm to about 560 nm and a part ofthe wavelength conversion particles 420 converts the blue light into thered light having the wavelength in the range of about 630 nm to about660 nm.

In addition, the wavelength conversion particles 420 can convert the UVlight emitted from the light emitting diodes 300 into the blue light,the green light and the red light. That is, a part of the wavelengthconversion particles 420 converts the UV light into the blue lighthaving the wavelength in the range of about 430 nm to about 470 nm, anda part of the wavelength conversion particles 420 converts the UV lightinto the green light having the wavelength in the range of about 520 nmto about 560 nm. Further, a part of the wavelength conversion particles420 converts the UV light into the red light having the wavelength inthe range of about 630 nm to about 660 nm.

In other words, if the light emitting diodes 300 are blue light emittingdiodes that emit the blue light, the wavelength conversion particles 420capable of converting the blue light into the green light and the redlight may be employed. In addition, if the light emitting diodes 300 areUV light emitting diodes that emit the UV light, the wavelengthconversion particles 420 capable of converting the UV light into theblue light, the green light and the red light may be employed.

The wavelength conversion particles 420 may include a plurality ofquantum dots. The quantum dots may include core nano-crystals and shellnano-crystals surrounding the core nano-crystals. In addition, thequantum dots may include organic ligands bonded to the shellnano-crystals. Further, the quantum dots may include an organic coatinglayer surrounding the shell nano-crystals.

The shell nano-crystals can be prepared as at least two layers. Theshell nano-crystals are formed on the surface of the core nano-crystals.The quantum dots lengthen the wavelength of the light incident into thecore nano-crystals by using the shell nano-crystals forming a shelllayer, thereby improving the light efficiency.

The quantum dots may include at least one of a group-II compoundsemiconductor, a group-III compound semiconductor, a group-V compoundsemiconductor, and a group-VI compound semiconductor. In more detail,the core nano-crystals may include CdSe, InGaP, CdTe, CdS, ZnSe, ZnTe,ZnS, HgTe or HgS. In addition, the shell nano-crystals may includeCuZnS, CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The quantum dotmay have a diameter of about 1 nm to about 10 nm.

The wavelength of the light emitted from the quantum dots can beadjusted according to the size of the quantum dot or the molar ratiobetween the molecular cluster compound and the nano-particle precursorin the synthesis process. The organic ligand may include pyridine,mercapto alcohol, thiol, phosphine and phosphine oxide. The organicligand may stabilize the unstable quantum dots after the synthesisprocess. Dangling bonds may be formed at the valence band and thequantum dots may be unstable due to the dangling bonds. However, sinceone end of the organic ligand is the non-bonding state, one end of theorganic ligand is bonded with the dangling bonds, thereby stabilizingthe quantum dots.

In particular, if the size of the quantum dot is smaller than the Bohrradius of an exciton, which consists of an electron and a hole excitedby light and electricity, the quantum confinement effect may occur, sothat the quantum dot may have the discrete energy level. Thus, the sizeof the energy gap is changed. In addition, the charges are confinedwithin the quantum dot, so that the light emitting efficiency can beimproved.

Different from general fluorescent pigments, the fluorescent wavelengthof the quantum dot may vary depending on the size of the particles. Indetail, the light has the shorter wavelength as the size of the particlebecomes small, so the fluorescent light having the wavelength band ofvisible ray can be generated by adjusting the size of the particles. Inaddition, the quantum dot represents the extinction coefficient higherthan that of the general fluorescent pigment by 100 to 1000 times andhas the superior quantum yield, so that strong fluorescent light can begenerated.

The quantum dots can be synthesized through the chemical wet scheme.According to the chemical wet scheme, the particles are grown byimmersing the precursor material in the organic solvent. The quantumdots can be synthesized through the chemical wet scheme.

The matrix 430 surrounds the wavelength conversion particles 420. Indetail, the wavelength conversion particles 420 are uniformlydistributed in the matrix 430. The matrix 430 includes polymer. Thematrix 430 is transparent. That is, the matrix 430 includes transparentpolymer.

The matrix 430 has a superior sealing function. In detail, the matrix430 has low oxygen transmissibility.

In addition, the matrix 430 can be formed by using high-density polymer.For instance, the matrix 430 may include polymer having the density ofabout 1.0 g/ml to about 2.0 g/ml. In addition, the matrix 430 mayinclude polymer having the refractive index of about 1.4 to about 1.6.

The matrix 430 may include epoxy resin, acryl resin, polyimide, orsilicon resin. Preferably, the matrix 430 may include the silicon resin.

The silicon resin may have the skeletal structure of siloxane bond(—Si—O—). In addition, the methyl group, the phenyl group or thehydroxyl group may be added to the siloxane skeletal structure.

For instance, the silicon resin can be expressed as following chemicalformula 1.

In chemical formula 1, R₁, R₂, R₂ and R₄ can be independently selectedfrom the group consisting of hydrogen, halogen element, alkyl group,aryl group, cyclo alkyl group and hetero aryl group.

In detail, the silicon resin used for the matrix 430 can be expressed asfollowing chemical formula 2.

In addition, the matrix 430 may further include a cross-linking agent.The sealing function of the matrix 430 can be more improved due to thecross-linking agent. The amount of the cross-linking agent added to thematrix 430 may be about 20 wt % to about 25 wt %.

For instance, the cross-linking agent may include one selected from thegroup consisting of 1,6-Hexanediol Diacrylate, Dipropylene glycolDiacrylate, Neopentyl glycol Diacrylate, Trimethylolpropane Triacrylate,Ethoxylated Trimethylolpropane Triacrylate, TrimethylolpropaneTrimethacrylate, Pentaerythritol Tetraacrylate, DipentaerylthritolHexaacrylate, Vinyltriethoxysilane, Vinyltrimethoxysilane,Vinyl-tris-(2-methoxyethoxy) silane and Vinylmethyldimethoxysilane.

In addition, the matrix 430 may include metal salt. In detail, thematrix 430 may include platinum salt. Due to the platinum salt, thesealing function of the matrix 430, in detail, the oxygen blockingproperty of the matrix 430 can be improved. The very small amount of theplatinum salt is included in the matrix 430. Preferably, the amount ofthe platinum salt included in the matrix 430 is about 0.01 wt % to about0.1 wt %.

The platinum salt may include platinum amine, platinum chloride orplatinum ammonium.

The matrix 430 is disposed in the tube 410. In detail, the matrix 430 isfully filled in the tube 410. The matrix 430 may adhere to an innersurface of the tube 410.

As shown in FIG. 5, the wavelength conversion member 400 may furtherinclude a sealing part 440.

The sealing part 440 is disposed in the tube 410. The sealing part 440is positioned at the end portion of the tube 410 to seal the tube 410.The sealing part 440 may include epoxy resin.

Due to the sealing part 440, the oxygen and moisture can be effectivelyinhibited from penetrating into the tube 410. In addition, the sealingpart 440 may further include the metal salt.

An air layer 450 can be interposed between the sealing part 440 and thematrix 430. The air layer 450 may include gas having a low reactivity,such as nitrogen or inert gas.

FIGS. 6 to 9 are views showing the procedure for fabricating thewavelength conversion member 400. As shown in FIGS. 6 to 9, thewavelength conversion member 400 is fabricated through the followingmethod.

Referring to FIG. 6, the tube 410 is prepared. One end of the tube 410is sealed and the other end of the tube 410 is open.

Referring to FIG. 7, the wavelength conversion particles 420 areuniformly distributed in a resin composition 431. The resin composition431 is transparent. The resin composition 431 may have the photo-curableproperty.

The resin composition 431 may include epoxy resin, acryl resin, polyamicacid, bisphenol A resin or silicon resin. In addition, the resincomposition 431 may include acrylate monomer or siloxane monomer.

In addition, the resin composition 431 may include a photo-curinginitiator. For instance, the photo-curing initiator may include oneselected from the group consisting of α-hydroxyketone, phenylglyoxylate,benzildimethyl ketal, α-aminoketone, mono acyl phosphine, bis acylphosphine, 2,2-dimethoxy-2-phenylacetophenone and a mixture thereof.

The resin composition 431 may further include the cross-linking agent.In addition, the resin composition 431 may further include an additiveto improve the sealing function. In detail, the metal salt, such as theplatinum salt, can be added to the resin composition 431 as theadditive.

After that, the internal pressure of the tube 410 is reduced and one endof the tube 410 is dipped into the resin composition 431 having thewavelength conversion particles 420 distributed therein. Then, theambient pressure is increased. Thus, the resin composition 431 havingthe wavelength conversion particles 420 distributed therein isintroduced into the tube 410.

Referring to FIG. 8, the resin composition 431 introduced into the tube410 is cured by the UV light, so that the matrix 430 is formed. At thistime, the UV light is simultaneously irradiated over the whole area ofthe tube 410 to cure the resin composition 431.

In contrast, referring to FIG. 9, the resin composition 431 introducedinto the tube 410 can be sequentially cured. That is, the UV light issequentially irradiated from one end to the other end of the tube 410 inorder to sequentially cure the resin composition 431 introduced into thetube 410.

In detail, the UV light is primarily irradiated onto the sealed endportion of the tube 410 and then consecutively moved toward the open endportion of the tube 410. At this time, a UV irradiator capable ofirradiating the UV light onto the very-limited region can be used.

The resin composition 431 may be shrunk during the photo-curing process.However, since the resin composition 431 introduced into the tube 410 issequentially cured from one end to the other end of the tube 410, thematrix 430 may not be spaced apart from the tube 410 caused by theshrinkage of the resin composition 431.

That is, when the resin composition 431 is cured and shrunk at one endof the tube 410, the non-cured resin composition 431 can be furthermoved to one end of the tube 410.

Therefore, the shrinkage of the resin composition 431 in the radialdirection can be reduced. That is, according to the curing method of theembodiment, the shrinkage of the resin composition 431 in the directionvertical to the length direction of the tube 410 can be reduced.

Thus, according to the curing method of the embodiment, the sealingdegree between the matrix 430 and the tube 410 can be improved and theoxygen can be inhibited from penetrating into the wavelength conversionparticles 420.

Referring again to FIGS. 1 to 4, the optical sheets 500 are disposed onthe light guide plate 200 to improve the characteristic of the lightpassing through the optical sheets 500.

The FPCB 600 is electrically connected to the light emitting diodes 300.The FPCB 600 can mount the light emitting diodes 300 thereon. The FPCB600 is installed in the mold frame 10 and arranged on the light guideplate 200.

The mold frame 10 and the backlight assembly 20 constitute the backlightunit. That is, the backlight unit includes the mold frame 10 and thebacklight assembly 20.

The liquid crystal panel 30 is installed in the mold frame 10 andarranged on the optical sheets 500.

The liquid crystal panel 30 displays images by adjusting intensity ofthe light passing through the liquid crystal panel 30. That is, theliquid crystal panel 30 is a display panel to display the images. Theliquid crystal panel 30 displays the images by using the light havingthe wavelength converted by the wavelength conversion member 400. Theliquid crystal panel 30 includes a TFT substrate, a color filtersubstrate, a liquid crystal layer interposed between the above twosubstrates and polarizing filters.

As described above, the wavelength conversion particles 420 are disposedin the matrix 430 having the superior sealing function. In particular,since the matrix 430 includes the epoxy resin, acryl resin, polyimide,silicon resin or polycarbonate, the oxygen and the moisture can beinhibited from penetrating into the matrix 430. In addition, the matrix430 includes the metal salt, such as the platinum salt, so that theoxygen blocking property of the matrix 430 can be improved.

As a result, the matrix 430 can effectively protect the wavelengthconversion particles 420 from the external chemical impact.

In particular, the matrix 430 disposed in the tube 410 has the superiorsealing property, an additional sealing part is not necessary to sealthe end portions of the tube 410. Thus, the wavelength conversion member400 can be readily fabricated.

Therefore, the liquid crystal display device according to the embodimentmay improve the reliability and the image quality.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effects such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

EXPERIMENTAL EXAMPLE

About 10 wt % of quantum dots (available from NANOSYS, Inc.) was addedto silicon resin having the chemical formula as shown below.

(wherein n is 5˜20, and molecular weight is 1000˜10000)

In addition, about 20 wt % of cross-linking agent was added to thesilicon resin and about 0.01 wt % of platinum amine was added to thesilicon resin. The resin composition #1 prepared through the aboveprocess was uniformly mixed by a planetary mill and aged for 12 hours.After that, the resin composition #1 was introduced into a capillarytube having a width of about 2 mm and a thickness of about 1 mm and theresin composition #1 was cured by the UV light, thereby fabricating thewavelength conversion member #1.

COMPARATIVE EXAMPLE

The cross-linking agent and quantum dots were added to a dispersivemedium (product) of NANOSYS, Inc., similarly to the experimental exampleexcept for the platinum amine, thereby forming the resin composition #2.After that, the wavelength conversion member #2 was fabricated similarlyto the experimental example.

Then, the wavelength conversion member #1 and the wavelength conversionmember #2 were exposed in the high-density and high-pressure oxygenatmosphere for 24 hours. The wavelength conversion efficiency of thewavelength conversion member #1 was about 90% and the wavelengthconversion efficiency of the wavelength conversion member #2 was about80%.

What is claimed is:
 1. A display device comprising: a light source; awavelength conversion member into which light generated from the lightsource is incident; and a display panel into which light is incidentfrom the wavelength conversion member, wherein the wavelength conversionmember comprises: a receiving part having a pipe shape; a matrix in thereceiving part; and a plurality of wavelength conversion particlesdisposed in the matrix to convert a wavelength of the light generatedfrom the light source, and wherein the matrix comprises epoxy resin,acryl resin, polyimide, silicon resin or polycarbonate.
 2. The displaydevice of claim 1, wherein the matrix is filled in the receiving partranging from one end to an opposite end of the receiving part.
 3. Thedisplay device of claim 1, wherein the matrix has a length correspondingto a length of the tube.
 4. The display device of claim 1, wherein thematrix includes platinum salt disposed in the silicon resin.
 5. Thedisplay device of claim 1, further comprising a sealing part disposed atone end of the receiving part to seal the receiving part.
 6. The displaydevice of claim 5, wherein the sealing part includes metal salt.
 7. Thedisplay device of claim 5, wherein the matrix includes a cross-linkingagent.
 8. A wavelength conversion member comprising: a receiving part; amatrix disposed in the receiving part and including silicon resin; and aplurality of wavelength conversion particles in the matrix, wherein thematrix comprises epoxy resin, acryl resin, polyimide, silicon resin orpolycarbonate.
 9. The wavelength conversion member of claim 8, furthercomprising a sealing part disposed at one end of the receiving part toseal the receiving part.
 10. The wavelength conversion member of claim8, wherein the matrix includes metal salt.
 11. The wavelength conversionmember of claim 10, wherein the metal salt is platinum salt and anamount of the platinum salt included in the matrix is about 0.01 wt % toabout 0.1 wt %.
 12. The wavelength conversion member of claim 8, whereinthe matrix includes the silicon resin represented by the followingchemical formula 1:

wherein, R₁, R₂, R₃ and R₄ are independently selected from the groupconsisting of hydrogen, halogen element, alkyl group, aryl group, cycloalkyl group and hetero aryl group.
 13. The wavelength conversion memberof claim 8, wherein the matrix includes the silicon resin represented bythe following chemical formula 2: